Browsing Engineering (Faculty of) by Subject "QFN Package"
Now showing items 1-1 of 1
-
Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials
(IMAPS, 2013)Cost reduction is the main driver in the recent transition to Cu wire bonding from predominate Au wire bonding. Other cost reduction in packaging comes from new developments in substrates and lead frames, for example, ...